© Mouldex Automation Limited 2009

Mouldex Automation Limited

The Sir Colin Campbell Building

The University of Nottingham Innovation Park

Triumph Road, Nottingham, NG7 2TU

+44 115 714 9518

Helping you shape protection

Potting

Low viscosity polyamide resin can be used as a direct replacement for two part potting compounds, can often be used to eliminate the need for a separate housing, dramatically reduces WIP, frees up valuable production space and having a fast process time usually wins. UL94-V0 and UL746b with RTI rating up to 95 deg C grades are available.

Over-moulding

Probably the simplest application and the widest used on cables and connectors  especially if they need flexible strain relief on cable exits, from soft to hard feel there are a range of polyamide copolymers to suit most demanding requirements. Over-moulded connectors generally achieve IP67

Encapsulation

A growing application is over-moulding PCB’s and their cable exits, if the board is small then encapsulation can often be achieved in a single step, however it is more common to be done in two stages. We can help you encapsulate PCB’s in very complex shapes and in  a wide range of materials

Orientation moulding and surface protection

Customers are using this rapid process to join dissimilar items such as pipes and cables in a form so they can be fitted directly to the product in the shortest possible time, other moulded forms can act as protection from abrasion or as sound reduction, either from direct contact or harmonic induced noise.